E7L系列Q170平臺(tái)嵌入式工控機(jī)/BOX
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產(chǎn)品描述
阿普奇嵌入式工控機(jī)E7L系列Q170平臺(tái)是一款專為工業(yè)自動(dòng)化和邊緣計(jì)算設(shè)計(jì)的強(qiáng)大設(shè)備。它支持最新的Intel處理器，包括6至9代Core、Pentium和Celeron系列，提供高效性能和穩(wěn)定運(yùn)行。采用Intel Q170芯片組，提供穩(wěn)健的硬件平臺(tái)和豐富的擴(kuò)展功能。該平臺(tái)配備2個(gè)千兆網(wǎng)絡(luò)接口，確保高速穩(wěn)定的網(wǎng)絡(luò)連接。內(nèi)存方面，E7L系列支持最大64GB DDR4內(nèi)存，滿足大量數(shù)據(jù)和復(fù)雜計(jì)算需求。此外，它還提供4個(gè)DB9串口，支持RS232/RS422/RS485協(xié)議，便于與外部設(shè)備通信。在顯示方面，該平臺(tái)擁有4路顯示輸出，支持VGA、DVI-D、DP和內(nèi)部LVDS/eDP，最高支持4K@60Hz分辨率。無(wú)線功能方面，E7L系列支持4G/5G/WIFI/BT擴(kuò)展，滿足各種無(wú)線通信需求。此外，它還提供MXM和aDoor模塊擴(kuò)展支持，可根據(jù)應(yīng)用需求進(jìn)行定制配置。供電方面，支持9~36V直流供電（可選12V），確保穩(wěn)定運(yùn)行。散熱設(shè)計(jì)采用無(wú)風(fēng)扇被動(dòng)式散熱，提高系統(tǒng)可靠性。
總之，阿普奇E7L-Q170嵌入式工控機(jī)為工業(yè)自動(dòng)化和邊緣計(jì)算提供強(qiáng)大支持，滿足各種復(fù)雜應(yīng)用場(chǎng)景的需求。
|
Model |
E7L |
E7DL |
E7QL |
|
|
CPU |
CPU | Intel??6/7/8/9th Generation Core / Pentium/ Celeron Desktop CPU | ||
| TDP | 35W | |||
| Socket | LGA1151 | |||
|
Chipset |
Chipset | Q170 | ||
|
BIOS |
BIOS | AMI UEFI BIOS (Support Watchdog Timer) | ||
|
Memory |
Socket | 2 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 up to 2133MHz | ||
| Max Capacity | 64GB, Single Max. 32GB | |||
|
Graphics |
Controller | Intel??HD Graphics | ||
|
Ethernet |
Controller | 1 * Intel i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel i219-LM/V GbE LAN Chip (10/100/1000 Mbps) |
||
|
Storage |
SATA | 1 * SATA3.0, Quick release 2.5" hard disk bays (T≤7mm) 1 * SATA3.0, Internal 2.5" hard disk bays (T≤9mm, Optional) Support RAID 0, 1 |
||
| M.2 | 1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, NVMe/SATA SSD Auto Detect, 2280) | |||
|
Expansin Slots |
PCIe/PCI | N/A | ①: 1 * PCIe x16 (x16) + 1 * PCIe x4 (x4) ②: 1 * PCIe x16 + 1 * PCI ③: 2 * PCI PS: ①、②、③?One out of three, Expansion card length ≤ 185mm, TDP ≤ 130W |
①: 2 * PCIe x16 (x8/x8) + 2 * PCI②:1?* PCIe x16 (x16) + 1 * PCIe x4 (x4)
PS: ①、②?One out of two, Expansion card length ≤ 185mm, TDP ≤ 130W |
| MXM/aDoor | 1 * APQ MXM ?(Optional MXM 4 * LAN/4 * POE/6 * COM/16 * GPIO expansion card) | |||
| Mini PCIe | 1 * Mini PCIe (PCIe x1 Gen 2 + USB 2.0, with 1 * SIM Card) | |||
| M.2 | 1 * M.2 Key-B (PCIe x1 Gen 2 + USB3.0, with 1 * SIM Card, 3052) | |||
|
Front I/O |
Ethernet | 2 * RJ45 | ||
| USB | 6 * USB3.0 (Type-A, 5Gbps) | |||
| Display | 1 * DVI-D: max resolution up to 1920*1200 @ 60Hz 1 * VGA (DB15/F): max resolution up to 1920*1200 @ 60Hz 1 * DP: max resolution up to 4096*2160 @ 60Hz |
|||
| Audio | 2 * 3.5mm Jack (Line-Out + MIC) | |||
| Serial | 2 * RS232/422/485 (COM1/2, DB9/M, Full Lanes, BIOS Switch) 2 * RS232 (COM3/4, DB9/M) |
|||
| Button | 1 * Power Button + Power LED 1 * System Reset Button (Hold down 0.2 to 1s to restart, and hold down 3s to clear CMOS) |
|||
|
Rear I/O |
Antenna | 4 * Antenna hole | ||
| SIM | 2 * Nano SIM card slots | |||
|
Internal I/O |
USB | 2 * USB2.0 (wafer) | ||
| LCD | 1 * LVDS (wafer): max resolution up to 1920*1200 @ 60Hz | |||
| TFront Panel | 1 * TF_Panel (3 * USB 2.0 + FPANEL, wafer) | |||
| Front Panel | 1 * FPanel (PWR + RST + LED, wafer) | |||
| Speaker | 1 * Speaker (2-W (per channel)/8-Ω Loads, wafer) | |||
| Serial | 2 * RS232 (COM5/6, wafer) | |||
| GPIO | 1 * 16 bits DIO (8xDI and 8xDO, wafer) | |||
| LPC | 1 * LPC (wafer) | |||
| SATA | 2 * SATA 7P Connector | |||
| SATA Power | 2 * SATA Power (wafer) | |||
| FAN | 1 * CPU FAN (wafer) 2 * SYS FAN (wafer) |
|||
|
Power Supply |
Type | DC, AT/ATX | ||
| Power Input Voltage | 9 ~ 36VDC, P≤240W | |||
| Connector | 1 * 4Pin Connector, P=5.00/5.08 | |||
| RTC Battery | CR2032 Coin Cell | |||
|
OS Support |
Windows | 6/7th Core?: Windows 7/10/11 8/9th Core?: Windows 10/11 |
||
| Linux | Linux | |||
|
Watchdog |
Output | System Reset | ||
| Interval | Programmable via Software from 1 to 255 sec | |||
|
Mechanical |
Enclosure Material | Radiator: Aluminum alloy, Box: SGCC | ||
| Dimensions | 268mm(L) * 194.2mm(W) * 67.7mm(H) | 268mm(L) * 194.2mm(W) * 118.5mm(H) | 268mm(L) * 194.2mm(W) * 159.5mm(H) | |
| Weight | Net: 4.5 kg Total: 6 kg (Include packaging) |
Net: 4.7kg Total: 6.2 kg (Include packaging) |
Net: 4.8 kg Total: 6.3 kg (Include packaging) |
|
| Mounting | VESA, Wall mounted, Desktop | |||
|
Environment |
Heat Dissipation System | Fanless Passive Cooling | ||
| Operating Temperature | -20~60℃?(Industrial SSD) | |||
| Storage Temperature | -40~80℃?(Industrial SSD) | |||
| Relative Humidity | 10 to 90% RH (non-condensing) | |||
| Vibration During Operation | With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis) | |||
| Shock During Operation | With SSD: IEC 60068-2-27 (30G, half sine, 11ms) | |||
| Certification | CCC, CE/FCC, RoHS | |||
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嵌入式工控機(jī)/BOX E7L系列Q170平臺(tái)
